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ARQUIVO DE ACRÔNIMOS: ABREVIATURAS
Como o número de ACRÔNIMOS ["palavra formada pela primeira letra (ou mais de uma) de cada uma das partes sucessivas de uma locução, ou pela maioria dessas partes"] que figura na literatura científica - especialmente na de Química -, cresce à cada dia, o WebSite LQES coloca à disposição o ARQUIVO DE ACRÔNIMOS LQES.
Várias fontes foram cotejadas (veja referências após a letra Z) para constituir a versão 1.0, que receberá acréscimos à medida em que novas informações forem coletadas e/ou recebidas.
Para consultar o significado de um determinado Acrônimo, bastar clicar na letra correspondente à sua inicial.
Caso você não encontre o significado do Acrônimo nesta lista, visite a rubrica LQES Cultural/Links Selecionados/Dicionários
Maria Isolete Alves, Managing Editor
A - voltar |
AAS |
Atomic absorption spectroscopy |
ACF |
Anisotropic conductive film |
ADES |
Angle dispersed electron spectroscopy |
AEM |
Analytical electron microscopy, |
AES |
Auger electron spectroscopy |
AES |
Atomic emission spectroscopy |
AF |
Antiferromagnetic |
AFM |
Atomic force microscopy |
ALD |
Atomic layer deposition |
ALE |
Atomic layer epitaxy |
ALP |
Atomic layer processing |
AME |
Angle-measuring equipment |
AP
|
Atom probe (analyzer) |
AP-CVD |
Atomic probe (analyzer); atomic property; annealing point; ammonium perchlorate |
APS |
Appearance potential spectroscopy |
AREM |
Atomic resolution electron microscopy |
ARM |
Atomic resolution microscopy |
ARP |
Angle resolved photoemission |
ARPS |
Angle-resolved photoemission spectroscopy |
ARUPS |
Angle-resolved ultraviolet photoelectron XPS |
ARXPS |
Angle-resolved XPS |
ASIC |
Application-specific integrated circuit |
B - voltar |
b.c.c. |
Body-centered cubic |
b.c.t. |
Body-centered tetragonal |
BE |
Backscattered electron |
BET |
Brunauer-Emmett-Teller |
BF |
Bright field |
BLE
|
Bombardment-induced light emission |
BOD |
Biological oxygen demand |
BOF |
Basic oxygen furnace |
BOP |
Basic oxygen process |
BPC |
Bonded phase chromatography |
BSE
|
Backscattered electrons |
BTE |
Boltzmann transport equation |
BW |
Bandwidth |
BZ
|
Brillouin zone |
C - voltar |
CAIBE |
Chemically assisted ion beam etching |
CARS |
Coherent anti-stokes Raman scattering
|
CAS |
Chemical Abstracts Service
|
CB |
Conduction band
|
CBD
|
Convergent beam diffraction
|
CBE |
Chemical beam epitaxy |
CBED
|
Convergent beam electron diffraction
|
CBIM |
Convergent-beam imaging microscopy |
CC |
Cluster center |
CCD
|
Charge-coupled device
|
c.c.p. |
Cubic close-packed |
CD |
Climb dislocation; compact disk; critical dimensions; circular dichroism; cross direction
|
CD-ROM |
Compact disk, read-only memory |
CDW
|
Charge density wave
|
CE
|
Cluster expansion (technique); conductive elastomer; carbon equivalent; current efficiency
|
CEMS
|
Conversion electron Mössbauer spectroscopy
|
CHF |
Critical heat flux |
CHM |
Chemical machining |
CI
|
Chemical ionization
|
CIS |
Constant initial state spectroscopy |
CIS |
Complex impedance spectroscopy |
CITS |
Current imaging tunneling spectroscopy |
Cl |
Cathodoluminescence |
CMA |
Cylindrical mirror analyzer |
CMC |
Ceramic matrix composites |
CMOS |
Complementary metal-oxide semiconductor |
CMR |
Contact microradiography |
CMT |
Cadmium mercury telluride |
COD |
Chemical oxygen demand; crack opening displacement |
CPAA |
Charged particle activation analysis |
CRT |
Cathode ray tube |
CS |
Chemisorption |
CSRS |
Coherent stokes Raman spectroscopy |
CTE |
Coefficient of thermal expansion |
CTEM |
Conventional transmission electron microscopy |
CTEM |
Conventional TEM (=TEM) |
CTF |
Contrast transfer function |
CTL |
Charge transport layer |
CV |
Capacitance-voltage; Charpy Vnotch; coefficient of variation |
C-V |
Current-voltage |
CVD |
Chemical vapour deposition |
CVT |
Chemical vapor transport |
CW
|
Continuous wave
|
D - voltar |
DAC |
Diamond anvil cell |
DENS |
Diffuse elastic neutron scattering |
DBM
|
Direct bombardment mod |
DF |
Dark field |
DFZ |
Defect-free zone |
DLTS |
Deep-level transient spectroscopy |
DME |
Dropping mercury electrode |
DMS |
Desorption mass spectroscopy |
DOF |
Depth of field |
DOM |
Dissolved organic matter |
DOC |
Density states |
DQC |
Decagonal quasicrystal |
DRAM |
Dynamic random access memory |
DSA |
Dimensionally stable anode |
DSC |
Differential scanning calorimetry |
DTA |
Differential thermal analysis |
DRX |
X-ray diffractometry |
DXRD
|
Dynamic X-ray diffraction |
E - voltar |
E-2E |
Electron coincidence spectroscopies |
EB-PVD
|
Electron beam; extrudable |
EB
|
Electron beam physical vapor deposition |
EBIC
|
Electron beam induced conductivity |
EB-PVD
|
Electron beam; extrudable |
EBSP |
Electron backscattered spectroscopy |
ECL |
Electrogenerated chemiluminescence |
ECP |
Electron channeling pattern |
ECR |
Electron cyclotron resonance |
ED |
Electrodeposition |
EDAX |
Energy dispersive X-ray analysis (Veja EDX) |
EDC |
Energy-distribution curve |
EDS |
Energy-dispersive X-ray spectrometry (Veja EDX) |
EDX |
Energy-dispersive X-ray spectroscopy (Também EDS ou EDXS) |
EELS |
Electron energy loss spectroscopy |
EEM |
Emission electron microscopy |
EEM |
Emission electron microscopy |
EFM |
Electrical force microscopy |
EG |
Electron gas; electrogalvanized; ethylene glycol |
EHP |
Electron-hole pair |
EI |
Electron impact |
EID |
Electron-induced desorption |
ELNES |
Energy-loss near-edge structure |
ELS |
Electron energy loss spectroscopy |
EM |
Emulsions; electromodulation |
EMA |
Electron micropobe analysis; ethylene-methyl acrylate |
EMAT |
Electromagnetic-acoustic transducer |
EMF |
Electromotive force |
EMI |
Electromagnetic interference |
EMR |
Electromagnetic radiation |
EOT |
Electrical oxide thickness |
EPC |
Electropowder coating |
EPMA |
Electron probe microanalysis |
EPR
|
Electron paramagnetic resonance |
ERS |
Enhanced Raman-spectroscopy |
ESCA |
Electron spectroscopy for chemical analysis (Veja XPS) |
ESD(MS) |
Electron stimulated desorption mass spectroscopy |
ESR |
Electron spin resonance |
EXAFS |
Extended (X-ray) absorption fine structure |
EXELFS
|
Extended (electron) energy loss fine structure |
F - voltar |
FAB |
Fast atom bombardment |
FAB(MS)
|
Fast atom bombardment mass spectroscopy |
f.c.c. |
Face-centered cubic |
FCG |
Fatigue crack growth
|
FCP |
Fatigue crack propagation |
f.c.t. |
Face-centered tetragonal |
FDMS |
Field desorption mass spectroscopy |
FED |
Field emission device |
FEED |
Field emission energy distributions |
FEG |
Field emission gun |
FEM |
Field emission microscopy |
FES |
Field-effect spectroscopy |
FG |
Fiberglass |
FIM |
Field ion microscopy |
FIMS |
Field ionization mass spectroscopy |
FLn |
Fully lamellar, narrow (spacing) |
FLw |
Fully lamellar, wide (spacing) |
FM |
Ferromagnetic |
FMCW |
Frequency-modulated continuous wave |
FOM |
Figure of merit |
FT |
Phase transformation |
FTICR |
Fourier transform ion cyclotron resonance (Também FTMS) |
FTIR |
Fourier transform infrared spectroscopy |
FTMS
|
Fourier transform mass spectrometer (Também FTICR) |
FWHM
|
Full width at half maximum |
G - voltar |
GA
|
Gas atomization |
GB
|
(gain) x (band-width) (product); grain boundary |
GDMS |
Glow discharge mass spectroscopy |
GLC
|
Gas-liquid chromatography |
GMR
|
Giant magnetoresistance |
GPC |
Gel permeation chromatography |
GR
|
Graphite |
GS |
Ground state |
GSC |
Gas solid chromatography |
GSMBE
|
Gas source MBE |
H - voltar |
HBT |
Hetero-junction bipolar transistor |
HDP |
High-density plasma
|
HEED |
High-energy electron diffraction
|
HEIS |
High energy ion scattering (Veja RBS) |
HEL |
High-energy laser |
HEM |
Heat exchange method
|
HLW
|
High-level (radioactive) waste
|
HMW
|
High molecular weight
|
HOMO
|
Highest occupied molecular orbital
|
HOMO-LUMO
|
Highest occupied molecular orbital- lowest unoccupied molecular orbital
|
HOLZ
|
Higher order laue zone |
HPHT |
High-pressure/high-temperature (technique) |
HPLC
|
High-pressure liquid chromatography
|
HPMV
|
High-pressure mercury vapor (lamp)
|
HREM
|
High-resolution electron microscopy |
HPT |
Heterojunction phototransistor |
HRELS
|
High-resolution energy-loss spectroscopy
|
HRS
|
High-resolution spectrometer
|
HRSEM
|
High-resolution SEM
|
HRTEM
|
High-resolution TEM
|
HSA |
Hemispherical analyzer |
HSLC |
High-speed liquid chromatography |
HTS
|
High-temperature sputtering; high temperature
superconductor
|
HTSEC
|
High-temperature size-exclusion chromatography
|
HV
|
High vacuum (valve)
|
HVEM
|
High voltage electron microscopy |
I - voltar |
IAES |
Ion induced Auger electron spectroscopy |
I/O |
Input/output |
IBAD
|
Ion-beam-assisted deposition
|
IBAE
|
Ion-beam-assisted etching
|
IBSD
|
Ion beam sputter deposition
|
IC
|
Integrated circuit
|
ICP
|
Inductively coupled plasma |
ICPMS
|
Inductively coupled plasma mass spectroscopy |
IDOS |
Integrated density of states |
IE
|
Imaging ellipsometry
|
IETS |
Inelastic electron tunneling spectroscopy |
IGFET |
Insulated-gate field-effect transistor |
IILE
|
Ion-induced light emission
|
IMP(A)
|
Ion microprobe analysis |
INS |
Ion neutralization spectroscopy |
IPE |
Inverse photo emission |
IPL |
Ion projection lithography |
IPS |
Inverse photoemission |
IQC |
Icosahedral quasicrystal |
IR
|
Induced radioactivity; infrared
|
IRED
|
Infrared emitting diode
|
ISS |
Ion scattering spectroscopy |
IUPAC |
International union for pure and applied chemistry |
IV |
Intermediate valence
|
I-V
|
Current (I)-voltage(V)
|
k - voltar |
KMC |
Kinetic Monte Carlo (simulations) |
Kossel |
Diffraction of electron-excited X-rays |
L - voltar |
L |
Langmuir (unit of gas dose) |
LACVD |
Laser-assisted CVD
|
LALLS |
Low-angle laser-light scattering
|
LAMMA |
Laser microprobe mass analysis |
LAXS
|
Low angle X-ray scattering |
LC |
Liquid chromatography |
LCAO |
Linear combination of atomic orbitals
|
LCD |
Liquid crystal display
|
LDMS
|
Laser desorption mass spectroscopy |
LDOS |
Local density of states |
LED |
Light-emitting diode
|
LEED |
Low energy electron diffraction |
LEELS |
Low energy electron loss spectroscopy |
LEEM |
Low energy electron microscopy |
LEIS |
Low energy ion (back) scattering |
LET |
Linear energy transfer |
LFM |
Lateral force microscopy
|
LIMA |
Laser induced ion mass analysis |
LIMS |
Laser ionization mass spectroscopy |
LLC |
Liquid-liquid chromatography |
LLW |
Low-level (radioactive) waste
|
LMW |
Low molecular weight
|
LNG |
Liquefied natural gas
|
LNT |
Liquid nitrogen temperature
|
LOX |
Liquid oxygen
|
LPCVD |
Low-pressure chemical vapor deposition
|
LPG |
Liquefied petroleum gas
|
LPS |
Laser plasma source |
LSC |
Liquid-solid chromatography |
LVM |
Local vibration mode
|
M - voltar |
MBE |
Molecular beam epitaxy |
MBMS |
Molecular beam mass spectroscopy |
MCD |
Magnetic circular dichroism
|
MCVD |
Modified chemical vapor deposition
|
ME |
Microellipsometry
|
MFM |
Magnetic force microscopy
|
MIM |
Metal-isolator-metal
|
MIR-IR
|
Multiple internal reflectance infrared spectroscopy
|
ML |
Monolayer; mega-Langmuir
|
MLC |
Multilayer capacitor; multilayer ceramic
|
MMC
|
Metal matrix composites |
MMR
|
Magnetically modulated microwave reflection |
MOCVD |
Metallorganic chemical vapor deposition |
MOD |
Metallorganic decomposition |
MOLE |
Molecular optical laser examiner
|
MO-MBE |
Metallo-organic MBE |
MOS |
Metal-oxide-semiconductor
|
MOSFET |
Metal-oxide-semiconductor field effect transistor
|
MQW |
Multiple quantum well
|
MR |
Magnetoresistance
|
MS |
Mass spectroscopy |
MSANS |
Multiple small angle neutron scattering |
MULSAM
|
Multispectral auger microscope |
MW |
Molecular weight |
MWCVD |
Microwave-plasma CVD
|
MXPS
|
Monochromatized x-ray photoelectron spectroscopy
|
N - voltar |
NAA |
Neutron activation analysis |
NCEM
|
National Center for Electron Microscopy (Berkeley, CA) |
ND |
Neutron diffraction |
NDT |
Non-destructive testing |
NHE |
Normal hydrogen electrode |
NI |
Nanoindentation |
NIS |
Neutron inelastic scattering |
NIST |
National Institute of Standards and Technology (Antes: National Bureau of Standards) |
NLO |
Nonlinear optical |
NMR |
Nuclear Magnetic Resonance |
NQR |
Nuclear quadrupole resonance spectroscopy |
NSOM |
Near-field scanning optical microscopy |
NTM |
Non-transition metal |
O - voltar |
OB |
Occupied band |
OE |
Optical emission
|
OEIC |
Opto-electronic integrated circuit
|
OLED |
Organic light-emitting diode
|
OM |
Optical microscopy |
OMVPE |
Organometallic vapor-phase epitaxy
|
P - voltar |
PA |
Plasma arc |
PACE |
Plasma-assisted chemical etching |
PACVD |
Plasma-assisted CVD |
PAM |
Photo acoustic microscopy |
PAS |
Photoacoustic spectroscopy; positron annihilation spectroscopy |
PBG |
Photonic band gap
|
PC |
Photonic crystal; polycarbonate
|
PCM |
Phase change material; point-charge model
|
PCVD |
Plasma-assisted chemical vapor deposition
|
PD |
Phase diagram; photodetector; plasma doping
|
PDA |
Photodiode array
|
PDOS |
Phonon density of states |
PDS
|
Photothermal deflection spectroscopy |
PECVD |
Plasma-enhance CVD |
PEEM |
Photo emission electron microscopy |
PEM |
Plastic encapsulated microcircuit |
PES |
Photoelectron spectroscopy |
PESM |
Photo electron spectro microscopy |
PET |
Positron emission tomagraphy; pentaerythritol; poly(ethylene terephthalato) |
PEYS |
Photo electron yield spectroscopy
|
PGC |
Pirolysis gas chromatography |
PIXE |
Particle induced X-ray emission |
PL |
Photolominescence |
PLAD |
Pulsed laser ablation deposition |
PLD |
Pulsed laser deposition |
PLZT |
Lead lanthanum zirconate titanate |
PMR |
Proton magnetic resonance |
PMT |
Photomultiplier tube; polymethylpentene |
PN |
Periodic number |
PODSA |
Position sensitive atom probe |
ppm |
Parts per million |
PSD |
Position sensitive detector |
PSD(MS) |
Photon stimulated desorption mass spectroscopy |
PSZ |
Partially stabilized zirconia |
PTCR
|
Positive temperature coefficient for resistance |
PVD
|
Physical vapour deposition |
Q - voltar |
QC |
Quasicrystalline; quasicrystal |
QD |
Quatum dot
|
QENS |
Quasielastic neutron scattering
|
QMS |
Quadrupole mass spectroscopy
|
QN
|
Quantum number
|
QW |
Quantum well
|
R - voltar |
RAE |
Resistive anode encoder |
RAM |
Random-access memory |
RAP |
Reactive atmosphere processing |
RBS
|
Rutherford backscattering spectroscopy (Também HEIS) |
RCE |
Rotating compensator ellipsometer |
RDF |
Radial distribution function
|
RDS |
Rate determining step; reflection difference spectroscopy
|
RED |
Reflection electron diffraction |
REM |
Reflection electron microscopy |
REMPI |
Resonantly-enhanced multi-photon ionization |
REP |
Rotating electrode process |
RF |
Radiofrequency
|
RGA |
Residual gas analyzer
|
RH |
Relative humidity
|
RHE |
Reversible hydrogen electrode
|
RHEED |
Reflection high energy electron diffraction |
RIE |
Reactive ion etching |
RIR |
Reference intensity ratios |
RMS |
Root mean square |
RSF
|
Relative sensitivity factor |
RT |
Time real; room temperature |
RTA |
Rapid thermal annealing
|
RTE
|
Real time ellipsometry
|
RTP
|
Rapid thermal processing
|
RTPCVD
|
Rapid thermal processing CVD
|
S - voltar |
SACP |
Selected area channeling pattern |
SAD
|
Selected area diffraction |
SALI |
Surface analysis by laser ionization |
SAM |
Scanning Auger microscopy |
SANS |
Small angle neutron scattering |
SAXS |
Small angle X-ray scattering |
SBM |
Separate bombardment mode |
SE |
Secondary electron |
SEAM |
Scanning electron acoustic microscopy |
SEM |
Scanning electron microscopy |
SERS |
Surface enhanced Raman scattering |
SEXAFS |
Surface EXAFS or Synchrotron EXAFS |
SHEED |
Scanning high energy electron diffraction |
SIIMS |
Secondary ion imaging mass spectroscopy |
SIMS |
Secondary ion mass spectroscopy |
SIPS |
Sputter induced photon spectroscopy |
SLAM |
Scanning laser acoustic microscopy |
SNMS |
Sputter neutral mass spectroscopy |
SNOM |
Scanning nearfield optical microscopy |
SOM |
Scanning optical microscopy |
SOMSEM |
SOM in SEM |
SPAM |
Scanning photo acoustic microscopy |
STEM |
Scanning transmission electron microscopy |
STM |
Scanning tunneling microscopy |
STS |
Scanning tunneling spectroscopy |
STXM |
Scanning transmission X-ray microscopy |
SXE |
Soft X-ray emission |
SXM
|
Scanning X-ray microscopy |
T - voltar |
TCP |
Transmission channeling pattern |
TD
|
Theoretical density |
TEM |
Transmission electron microscopy |
TGA |
Thermogravimetric analysis |
TL |
Thermoluminescence |
TMA |
Thermomechanical analysis |
TMS |
Tetramethylsilane |
TOF |
Time of flight |
TRSS |
Time-resolved Raman spectroscopy |
TXRF
|
Total reflection X-Ray fluorescence |
U - voltar |
UPS |
Ultraviolet photoelectron spectroscopy |
UTW
|
Ultra thin window (detector) |
V - voltar |
VUV |
Vacuum ultraviolet |
W - voltar |
WDS |
Veja WDX |
WDX
|
Wavelength dispersive X-ray spectrometry (Também WDS) |
WF
|
Work function |
X - voltar |
XAFS |
X-ray absorption spectroscopy |
XANES |
X-ray absorption near edge structure |
XPS
|
X-ray photoelectron spectroscopy |
XRD |
X-ray diffraction |
XRF |
X-ray fluorescence |
XRM
|
X-ray microscopy |
Z - voltar |
ZAF |
Atomic number, absorption and fluorescence corrections pattern |
Fontes:
- W.S. Young, G.L. McVay and G.E. Pike (eds.), Ceramic Transactions, vol.5, Advanced Characterization Techniques for Ceramics, American Ceramic Society, Westerville, (1988).
- P.J. Goodhew and J.E. Castle, Institute of Physics EMAG, 515, (1983).
- P.E.J. Flewitt and R.K. Wild, "Physical Metods for Materials Chraracterisation", Institute of Physics Publishing, Bristol, (1994).
- Bushow, K.H.J. et al., "Encyclopedia of Materials: Science and Technology", Elsevier Science Ltd., Oxford, (2001).
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